ELECTRONIC ASSEMBLY OF CIRCUIT BOARDS
Some sectors require washing of the electronic boards after the soldering processes. The reasons can be many…
Our company has a complete internal testing department with test benches and working stations for mechanical assembly…
SMT technology (Surface Mount Technology) concerns the assembly and soldering of all the components…
THT technology (Trough Hole Technology) concerns the assembly and soldering of all the components that are connected…
VAPOR PHASE OVEN
For a long time our Company specialized in soldering processes using vapour phase ovens.
We knew right away the extraordinary potential of this technology.
This type of oven differs substantially from the traditional convection type because it does not use the forced circulation of hot air to transfer heat to the metals to be melted but uses the principle of condensation-evaporation of a liquid inside a closed chamber.
ELECTRONIC ASSEMBLIES X-RAY INSPECTION
An important input to the introduction of this technology in the field of electronic assemblies came with the introduction of BGA components in mass production.
The possibility of inspecting the quality of the joints placed under the body of the component, and therefore hidden from visual inspection, was immediately evident but the X-ray inspection then proved to be a particularly stimulating field of technological development with fundamental repercussions in company activities as well.